Nicslab has been selected for the TOP100 Program and will exhibit at the Echelon Asia Summit 2023

• Nicslab Selected for Prestigious TOP100 Program, a Testament to Innovation and Excellence.

• Nicslab Set to Make Waves at Echelon Asia Summit 2023: Visit Booth 24 in Singapore Expo Hall 3A.

Nicslab has been chosen as a participant in the esteemed TOP100 Program and will be unveiling our innovative solutions at the renowned Echelon Asia Summit. Mark your calendars for June 14-15 and join us at Booth 24 in Singapore Expo Hall 3A.

With a gathering of over 5,000 delegates from across Asia, featuring more than 200 exhibiting companies, and a plethora of business matching sessions, this event is an unparalleled opportunity to forge connections for fundraising and collaboration.

Echelon Asia Summit, hosted by e27, serves as the convergence point for the brightest minds in Asia's startup landscape. It is where groundbreaking ideas are shared, meaningful connections are made, and top talent is discovered. We extend our heartfelt gratitude to Hub.id and Kominfo Indonesia for granting us this exceptional chance.

Nicslab is a visionary fabless chip company specializing in chip-scale integrated electronic and photonic solutions for data centers, artificial intelligence (AI), instrumentation, and quantum computing. Our groundbreaking solutions enable faster and more efficient processing and transfer of data. Moreover, we are dedicated to developing tools that empower scientists and engineers to achieve greater efficiency in their endeavors.

For more details, visit the official Echelon page and secure your spot among the trailblazers of the industry. Powerful innovations await. See you at Echelon Asia Summit!

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